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Isolation
隔离芯片是在一个器件上集成了一个高压功率MOSFET开关以及初级控制器和次级同步整流控制器。它采用一种使用封装引线框和焊线的创新性电感耦合反馈设计，提供一种可靠...
 
Isolation
查看隔离型号为HCPL-250L&500，品牌为Broadcom的大图  
 
HCPL-250L&500
There is sufficient supply and we are currently supplying
1
 
Chip Information    
Model   HCPL-250L&500
Brand   Broadcom
PDF   Viewing PDF files
Inventory quantity   14330
Characteristic    
Minqty   1
Packaging   8-SMD，鸥翼
Supply Voltage   3750Vrms
Temperature   -55°C ~ 100°C
LAB/CCB   DC
Number of units   有基极的晶体管
 
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